Hardware Mobile Phones

iPhone 3G S Gets Ripped And Dissected Into Pieces, Unveiling ARM Cortex A8 CPU At 600 MHz

With only hours before iPhone’s 3G S version officially goes up on sale across the world, Rapid Repair gang have managed to get their hands on one of Apple’s few available copies around, and dissected it into pieces,  letting us closely look into the main components assembled inside, including chips, amps, processors and involved manufacturing companies, who helped Cupertino building this powerful machine. From their tear-down, we learn that South Korean giant, Samsung provides the SoC S5PC100 chipset, while main processor confirmed to be ARM Cortex A8, running at 600 MHz, with 720p high-def support. PowerVR SGX graphics also integrated within the iPhone 3G S, with 256MB of RAM, instead of 128MB on previous models.  In addition, we can see the NAND Flash memory, provided by Toshiba and Infenion is there as well, providing myriad parts of the phone. Hit the jump to checkout the comparison chart of iPhone’s hardware and Palm’s Pre, as more pictures available at their website. Also, feel free to start sharing your personal reviews, once getting a brand new iPhone 3G S in the following days.

Update: iSuppli says the estimated cost of Apple’s new iPhone 3GS for the 16GB configuration, stands at $178.96 to manufacture. Mind you, this price valuation, refers to direct materials cost, with no inclusion of other essential operational expenses, such as shipping, distribution, royalty fees etc, which add some value to the overall price.Check out their components and cost drivers table, after the break.

iphone-3g-s-dissected

[via RapidRepair]

iphone-3g-s-parts

x iPhone 2G iPhone 3G iPhone 3G S Palm Pre
CPU Samsung S3C6400 Samsung S3C6400 Samsung S5PC100 Texas Instruments OMAP 3430
x ARM 11 412 MHz, PowerVR MBX-Lite graphics ARM 11 412 MHz, PowerVR MBX-Lite graphics ARM Cortex A8 600 MHz, PowerVR SGX graphics ARM Cortex A8 600MHZ, PowerVR SGX 530 (GPU), 430MHz C64x, DSP and ISP (Image Signal Processor)
Baseband Processor x Infineon 208 (PMB 8877) x Qualcomm MSM6801A
Storage Samsung NAND Internal 4/8/16 GB Toshiba NAND Internal 8/16 GB Internal 16/32 GB Internal 8 GB
Memory 128 MB RAM Samsung 128 MB DDR RAM 256 MB RAM 256MB DDR2
LCD 3.5-inch 480-by-320-pixel at 163 ppi Multi-Touch display 3.5-inch 480-by-320-pixel at 163 ppi Multi-Touch display 3.5-inch 480-by-320-pixel at 163 ppi Multi-Touch display 3.1-inch 480-by-320-pixel Multi-Touch display
Battery Talk/Video/Web: Talk/Video/Web: Talk/Video/Web: Talk
x 8/7/6 hours 5/7/5 hours 5/10/9 hours 5 Hours
x Audio: 24 hours Audio: 24 hours Audio: 30 hours x
Connectivity GSM/EDGE (850, 900, 1800, 1900 MHz) UMTS/HSDPA (850, 1900, 2100 MHz) UMTS/HSDPA (850, 1900, 2100 MHz) UMTS/HSDPA (1900, 2100 MHz)
x Wi-Fi (802.11b/g) GSM/EDGE (850, 900, 1800, 1900 MHz) GSM/EDGE (850, 900, 1800, 1900 MHz) GSM/EDGE (850, 900, 1800, 1900 MHz)
x Bluetooth 2.0 + EDR Wi-Fi (802.11b/g) Wi-Fi (802.11b/g) Wi-Fi (802.11b/g)
x x Bluetooth 2.0 + EDR Bluetooth 2.1 + EDR Bluetooth 2.1 + EDR
Size 115 x 61 x 11.6 mm, 135 Grams 115.5 x 62.1 x 12.3 mm, 133 Grams 115.5 x 62.1 x 12.3 mm, 135 Grams 100.5 x 59.5 x 16.95, 135 Grams
Camera 2 Megapixels 2 Megapixels 3 Megapixels x
x x x x x
Battery stats assume usage of 3G network, times vary with 2G network use for cellular and wifi for internet x x
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