If you wanted to learn more about the main components that assemble your new iPhone 3G, the chips, the amps, the processors and the involved manufacturing companies, this is your chance to take a look at one the most detailed inside-views, as the guys from research firm Semiconductor Insights dissected the stellar handset into pieces, showing us who has done what. From the picture below, we understand that Infineon provides many of the components, including the GPS chip, the baseband chip, UMTS transceiver and the power management chip. In addition, we can see the application processor, provided by Samsung and the power amplifiers, provided by Triquint and Skyworks, as Marvell brings the Bluetooth and the WIFI components while Toshiba is responsible for the internal flash memory of your phone. The rest stays the same as the first generation, with Samsung to supply the ARM11processor architecture, Wolfson the audio decoder chip, Broadcom the touchscreen controller, National Semiconductor’s MPL the display interface, etc. Hit the jump to checkout more pictures and to see the videos. To get a bigger view just click in here.
[via Semiconductor Insights]
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